This is a very timely topic in advanced packaging. Cu–Cu hybrid bonding, co-packaged optics and heterogeneous integration are important technologies for high-performance computing, artificial intelligence hardware, data centers and future semiconductor systems. This lecture should be a good opportunity to learn how these technologies are being used in real products and where the field is heading.

Dr. John H. Lau is a senior special project assistant at Unimicron Technology Corporation and a Life Fellow of IEEE. He has more than 40 years of research, development and manufacturing experience in semiconductor packaging and surface-mount technology assembly. His previous roles include positions at Hewlett-Packard Laboratory, Agilent, the Institute of Microelectronics in Singapore, ITRI in Taiwan and ASM Pacific Technology. He's published more than 528 peer-reviewed papers, holds 53 issued and pending U.S. patents, and has authored 23 textbooks on advanced packaging, chiplets, heterogeneous integration, flip chip, and hybrid bonding. He is also a fellow of ASME and IMAPS.