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UID:https://events.ucf.edu/event/4137536/ieee-distinguished-lecture-by-dr-john-lau-cu-cu-hybrid-bonding-and-co-packaged-optics/
DTSTAMP:20260526T090000
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LOCATION:Virtual and R1:101: Research 1, Room 101

SUMMARY:IEEE Distinguished Lecture by Dr. John Lau, "Cu-Cu Hybrid Bonding and Co-Packaged Optics"
URL:https://events.ucf.edu/event/4137536/ieee-distinguished-lecture-by-dr-john-lau-cu-cu-hybrid-bonding-and-co-packaged-optics/
DESCRIPTION:The IEEE EPS Orlando Chapter is hosting a Distinguished Lecture by Dr. John H. Lau entitled "Cu-Cu Hybrid Bonding and Co-Packaged Optics." Light refreshments will be provided. This will be a hybrid event, with in-person attendance at R1-101 and a virtual option available by Zoom.\n\nThis is a very timely topic in advanced packaging. Cu-Cu hybrid bonding, co-packaged optics, and heterogeneous integration are important technologies for high-performance computing, AI hardware, data centers, and future semiconductor systems. This lecture should be a good opportunity to learn how these technologies are being used in real products and where the field is heading.\n\nDr. John H. Lau is a Senior Special Project Assistant at Unimicron Technology Corporation and a Life Fellow of IEEE. He has more than 40 years of research, development, and manufacturing experience in semiconductor packaging and surface-mount technology assembly. His previous roles include positions at Hewlett-Packard Laboratory, Agilent, the Institute of Microelectronics in Singapore, ITRI in Taiwan, and ASM Pacific Technology. He has published more than 528 peer-reviewed papers, holds 53 issued and pending U.S. patents, and has authored 23 textbooks on advanced packaging, chiplets, heterogeneous integration, flip chip, and hybrid bonding. He is also a Fellow of ASME and IMAPS.\n\nVirtual Location URL: https://ucf.zoom.us/j/93346344518?pwd=90S6FkGJH3I6QDXaVFvWt74xk06cQ9.1
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