{
	"event_id": "1118818",
	"eventinstance_id": "4137598",
	"calendar": {
		"id": 4162,
		"title": "UCF.CAL.EVENTS",
		"slug": "ucfcalevents",
		"url": "https://events.ucf.edu/calendar/4162/ucfcalevents/"
	},
	"id": "4137598",
	"title": "IEEE Distinguished Lecture by Dr. John Lau, \u0022Cu\u002DCu Hybrid Bonding and Co\u002DPackaged Optics\u0022",
	"subtitle": null,
	"description": "\u003Cp\u003EThe IEEE EPS Orlando Chapter is hosting a Distinguished Lecture by Dr. John H. Lau entitled \u0022Cu\u0026ndash\u003BCu Hybrid Bonding and Co\u002DPackaged Optics.\u0022 \u003Cstrong\u003ELight refreshments will be provided.\u003C/strong\u003E This will be a hybrid event, with in\u002Dperson attendance at R1\u002D101 and a virtual option available by Zoom.\u003C/p\u003E\u000A\u003Cp\u003EThis is a very timely topic in advanced packaging. Cu\u0026ndash\u003BCu hybrid bonding, co\u002Dpackaged optics, and heterogeneous integration are important technologies for high\u002Dperformance computing, AI hardware, data centers, and future semiconductor systems. This lecture should be a good opportunity to learn how these technologies are being used in real products and where the field is heading.\u003C/p\u003E\u000A\u003Cp\u003EDr. John H. Lau is a Senior Special Project Assistant at Unimicron Technology Corporation and a Life Fellow of IEEE. He has more than 40 years of research, development, and manufacturing experience in semiconductor packaging and surface\u002Dmount technology assembly. His previous roles include positions at Hewlett\u002DPackard Laboratory, Agilent, the Institute of Microelectronics in Singapore, ITRI in Taiwan, and ASM Pacific Technology. He has published more than 528 peer\u002Dreviewed papers, holds 53 issued and pending U.S. patents, and has authored 23 textbooks on advanced packaging, chiplets, heterogeneous integration, flip chip, and hybrid bonding. He is also a Fellow of ASME and IMAPS.\u003C/p\u003E",
	"location": "R1:101: Research 1, Room 101",
	"location_url": "https://www.ucf.edu/location/research\u002D1/",
	"virtual_url": "https://ucf.zoom.us/j/93346344518?pwd\u003D90S6FkGJH3I6QDXaVFvWt74xk06cQ9.1",
	"registration_link": null,
	"registration_info": null,
	"starts": "Tue, 26 May 2026 09:00:00 -0400",
	"ends": "Tue, 26 May 2026 10:00:00 -0400",
	"ongoing": "False",
	"category": "Speaker/Lecture/Seminar",
	"tags": ["College of Engineering and Computer Science","Microelectronics","Semiconductors","Free Food"],
	"contact_name": "Tengfei Jiang",
	"contact_phone": null,
	"contact_email": "Tengfei.Jiang@ucf.edu",
	"url": "https://events.ucf.edu/event/4137598/ieee-distinguished-lecture-by-dr-john-lau-cu-cu-hybrid-bonding-and-co-packaged-optics/"
}