The IEEE EPS Orlando Chapter is hosting a Distinguished Lecture by Dr. John H. Lau entitled "Cu–Cu Hybrid Bonding and Co-Packaged Optics." Light refreshments will be provided. This will be a hybrid event, with in-person attendance at R1-101 and a virtual option available by Zoom.

This is a very timely topic in advanced packaging. Cu–Cu hybrid bonding, co-packaged optics, and heterogeneous integration are important technologies for high-performance computing, AI hardware, data centers, and future semiconductor systems. This lecture should be a good opportunity to learn how these technologies are being used in real products and where the field is heading.

Dr. John H. Lau is a Senior Special Project Assistant at Unimicron Technology Corporation and a Life Fellow of IEEE. He has more than 40 years of research, development, and manufacturing experience in semiconductor packaging and surface-mount technology assembly. His previous roles include positions at Hewlett-Packard Laboratory, Agilent, the Institute of Microelectronics in Singapore, ITRI in Taiwan, and ASM Pacific Technology. He has published more than 528 peer-reviewed papers, holds 53 issued and pending U.S. patents, and has authored 23 textbooks on advanced packaging, chiplets, heterogeneous integration, flip chip, and hybrid bonding. He is also a Fellow of ASME and IMAPS.